Features and Advantages
Application Fields
Process Difficulties
Special Functions
Helping the semiconductor and precision electronic component manufacturing equipment to realize time precision and productivity jump,
realize real-time feedback and compensation of pressure changes, realize fast-paced, highly-stable and ultra-fine dispensing;
simple operation and easy maintenance, and rich supporting components and process solutions
For such process applications as semiconductor chip packaging and MEMS in which solder paste/silver paste is used to achieve conductive connection, common valves have problems such as low efficiency or high maintenance costs for consumables. Especially, mainstream 5# and 6# solder pastes are spotted, and the solder balls are easily broken by shock and thus block the nozzle.
When a conventional pneumatic dispensing controller is used in the above process applications, its slow output pressure response and low pressure stability, etc. lead to relatively poor dispensing consistency.
The KDC series controller with high-precision needles can perfectly solve the above problems.
Automatic Level Compensation
The deviation of glue amount caused by the level difference is eliminated, realizing stable dispensing and reducing poor production process.
Automatic Negative Pressure Compensation
The automatic suction pressure control can effectively prevent glue dripping and help eliminate bubbles to ensure stable dispensing.
Automatic Remaining Amount Warning
By accurately detecting the remaining glue amount in the bucket and comparing it with the set threshold, you are reminded to replace the glue bucket in time to prevent glue shortage.
Features and AdvantagesApplication Fields
Typical Applications
With nozzle calibration function, the nozzle sleeve can be replaced within 1 minute, and the glue amount accuracy can be controlled within ±2% (depending on different glues).
The nozzle and tappet structure design is more optimized; in combination with smooth trapezoidal wave control technology, the glue scattering rate is <0.5% to achieve good bubble control.
With unique structure and control design, the minimum dispensing diameter of 0.2mm can be achieved, dispensing can be done in a narrow gap of 0.1mm, and the minimum dot volume can be up to 0.5nL.
The parameters can be quantified and the adjustment is simple and convenient,so that it can be used widely.
It can be integrated with various dispensing systems to achieve high output and high consistency.
With modular design, special glue such as anaerobic glue and hot melt glue can be jetted after corresponding modules are replaced or added.
Consumables and usage costs can be reduced effectively.
Features and Advantages
Closed loop feedback control to improve the consistency of welded products
Short, fast and stable discharge control cycle, effective prevention of burns around the pad, and supporting standard MODBUS-RTU data communication
Features and Advantages
Micro pressure control, precise adjustment and stable pressure.
To check and record each welding pressure, and give an alarm when the pressure limit is exceeded.
Compact and lightweight, able to be flexibly integrated in automated production lines.
Supporting standard MODBUS-RTU data communication.
Features and Advantages
The conveying flow of the fluid is constant, and is not affected by viscosity or level changes of the fluid, ensuring accurate quantitative output.
With volumetric screw rotation conveying, most of low-, medium- and high-viscosity glue can be handled.
The glue height is automatically detected to give an alarm and carry out compensation when the limit is exceed, and the mixing ratio is controlled stably.
Supporting standard MODBUS-RTU data communication.
The liquid cooling system reduces the temperature in the mixing tube to extend the open time after the glue is mixed.
